From ASICs to SOCs: A Practical Approach
For a successful tape out, you should complete the following steps:
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Functional sign-off
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Timing sign-off
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DFT sign-off
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Physical sign-off
Some tips and guidelines for physical design were discussed in Section 4.3 including the following:
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After generating a floorplan with a chip-level timing budget, the logical hierarchy should match the physical one.
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For hierarchical methodology, use multiple placement-and-routing stages.
Examples of optimization techniques are gate sizing, buffer insertion/deletion, and placement optimization.
Two examples of new physical design techniques were presented in Section 4.4.
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